Will “Circuit Recorder” be Automated?

Core Skills & Abilities

• Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.

• Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.

• Maintain processing, production, and inspection information and reports.

• Load and unload equipment chambers and transport finished product to storage or to area for further processing.

• Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.

• Scribe or separate wafers into dice.

• Load semiconductor material into furnace.

• Inspect equipment for leaks, diagnose malfunctions, and request repairs.

• Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.

• Connect reactor to computer, using hand tools and power tools.

• Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.

• Count, sort, and weigh processed items.

• Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.

• Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.

• Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.

• Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.

• Stamp, etch, or scribe identifying information on finished component according to specifications.

• Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.

• Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.

• Calculate etching time based on thickness of material to be removed from wafers or crystals.