Will “Crystal Cutter” be Replaced By Robots? 🤔

88% Chance of Automation

“Crystal Cutter” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Crystal Cutter”

Load semiconductor material into furnace.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Count, sort, and weigh processed items.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Maintain processing, production, and inspection information and reports.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Scribe or separate wafers into dice.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Connect reactor to computer, using hand tools and power tools.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

Related Technology & Tools

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Solder-paste printers
Epitaxial deposition equipment
Vacuum ovens
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Automatic notched wafer aligners
Load ports
Laser wafer markers
Atmospheric pressure chemical vapor deposition APCVD systems
Slurry filter cabinets
Photoresist strippers
High precision tweezers
Wafer scanners
Electron beam evaporators
Chemical vapor deposition CVD systems
Sanding machines
Low pressure chemical vapor deposition LPCVD machines
Laboratory fume hoods
Manual wet benches
Wafer probers
Surface resistivity meters
Vacuum wands
Digital hygrometers
Water surface contamination analyzers
Automatic wafer cleaners
Desktop computers
Physical vapor deposition systems
Mask aligners
X-ray inspection equipment
Diffusion pumps
Plasma ashers
Surface profilers
Clean room ovens
Lithography exposure systems
Micro diamond scribers
Soldering guns
Wafer mappers
Vacuum pumps
Semiconductor test probes
Digital multimeters
Spin rinse dryers
Gas blow torches
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Photostabilizers
Oxidation systems
Rapid thermal processors
Antistatic wrist straps
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Safety eyewear
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Photolithography equipment
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Die bonders
Semiconductor etchers
Clean room suits

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