Will “Crystal Cutter” be Replaced By Robots? 🤔

88% Chance of Automation

“Crystal Cutter” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Crystal Cutter”

Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Connect reactor to computer, using hand tools and power tools.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Count, sort, and weigh processed items.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Load semiconductor material into furnace.
Scribe or separate wafers into dice.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Maintain processing, production, and inspection information and reports.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

Related Technology & Tools

Epitaxial deposition equipment
Digital hygrometers
Semiconductor polishers
Diffusion pumps
Load ports
Physical vapor deposition systems
Micro diamond scribers
Sanding machines
Surface resistivity meters
Semiconductor etchers
Automatic wafer cleaners
Mask aligners
Clean room ovens
Low pressure chemical vapor deposition LPCVD machines
Lithography exposure systems
Electron beam evaporators
Photoresist strippers
Semiconductor test probes
Wafer sorters
Scanning electron microscopes
Plasma-enhanced chemical vapor deposition PECVD machines
Oxidation systems
Clean-room air particle analyzers
Vacuum pumps
Laboratory fume hoods
Photolithography equipment
Wafer arbor presses
Vacuum wands
Sputterers
Die bonders
Vacuum ovens
Antistatic wrist straps
Solder reflow ovens
X-ray inspection equipment
Clean room suits
Slurry filter cabinets
Plasma ashers
Soldering guns
Automatic notched wafer aligners
Surface profilers
High precision tweezers
Desktop computers
Digital multimeters
Safety eyewear
Wafer scanners
Spectrum analyzers
Wafer probers
Chemical vapor deposition CVD systems
Semiconductor processing chillers
Spin rinse dryers
Water surface contamination analyzers
Photostabilizers
Atmospheric pressure chemical vapor deposition APCVD systems
Gas blow torches
Ion implanters
Diffusion furnaces
Solder-paste printers
Manual wet benches
Wafer mappers
Rapid thermal processors
Laser wafer markers

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