Will “Manufacture Specialist” be Replaced By Robots? 🤔
88% Chance of Automation
“Manufacture Specialist” will probably be replaced by robots.
This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.
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Job Description
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
Job Details
- The SOC (Standard Occupational Classification) code is 51-9141.00
- The Mean Annual Wage in the U.S. is $ 37,890.00
- The Mean Hourly Wage is $ 18.00
- Currently, there are 24,430 people on this job
☝️ Information based on the reference occupation “Semiconductor Processors”.
Also Known As…
- Semiconductor Processors
- Wafer Fabrication Operator
- Process Technician
- Probe Operator
- Metalorganic Chemical Vapor Deposition Engineer (MOCVD Engineer)
- Manufacturing Technician
- Fabrication Operator
- Engineering Technician
- Diffusion Operator
- Device Processing Engineer
- Wafer Production Worker
- Wafer Polishing Worker
- Wafer Mounter
- Wafer Machine Operator
- Wafer Fabricator
- Wafer Fabrication Technician
- Test Technician
- Semiconductors Wafer Breaker
- Semiconductors Metallization Equipment Tender
- Semiconductor Wafers Saw Operator
- Semiconductor Wafers Marker
- Semiconductor Wafers Etcher-Stripper
- Semiconductor Wafers Etch Operator
- Semiconductor Wafers Diffusion Furnace Operator
- Semiconductor Technician
- Semiconductor Processor
- Semiconductor Processing Group Leader
- Semiconductor Processing Equipment Test Technician
- Semiconductor Packages Sealer
- Semiconductor Lab Technician
- Semiconductor Dies Loader
- Semiconductor Assembler
- Semi Conductor Assembler
- Seed Core Operator
- Resistor Coater
- Reactor Technician
- Process Engineer
- Printed Circuit Photographer
- Microelectronics Technician
- Manufacture Specialist
- Lapping Machine Tender
- Lap Machine Tender
- Ion Implant Machine Operator
- Integrated Circuit Fabricator
- Etcher
- Epitaxial Reactor Technician
- Epitaxial Reactor Operator
- Electronic Semiconductor Processor
- Electronic Device Monitor
- Electronic Component Processor
- Diffusion Furnace Operator
- Die Attacher
- Crystal Slicer
- Crystal Mounter
- Crystal Machining Coordinator
- Crystal Lapper
- Crystal Growing Technician
- Crystal Grower
- Crystal Finisher
- Crystal Cutter
- Circuit Recorder
- Chemical Etch Operator
- Charge Preparation Technician
Tasks for “Manufacture Specialist”
- Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
- Load and unload equipment chambers and transport finished product to storage or to area for further processing.
- Scribe or separate wafers into dice.
- Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
- Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
- Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
- Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
- Calculate etching time based on thickness of material to be removed from wafers or crystals.
- Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
- Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
- Stamp, etch, or scribe identifying information on finished component according to specifications.
- Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
- Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
- Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
- Load semiconductor material into furnace.
- Count, sort, and weigh processed items.
- Inspect equipment for leaks, diagnose malfunctions, and request repairs.
- Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
- Connect reactor to computer, using hand tools and power tools.
- Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
- Maintain processing, production, and inspection information and reports.
- Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
- Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
- Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
Related Technology & Tools
- Oxidation systems
- Wafer scanners
- Sputterers
- Digital multimeters
- Desktop computers
- Vacuum wands
- Semiconductor polishers
- Photolithography equipment
- Semiconductor processing chillers
- Rapid thermal processors
- Gas blow torches
- Clean-room air particle analyzers
- Spin rinse dryers
- Semiconductor etchers
- Laboratory fume hoods
- Solder-paste printers
- Wafer arbor presses
- X-ray inspection equipment
- Surface profilers
- High precision tweezers
- Safety eyewear
- Plasma ashers
- Wafer sorters
- Epitaxial deposition equipment
- Soldering guns
- Semiconductor test probes
- Plasma-enhanced chemical vapor deposition PECVD machines
- Sanding machines
- Clean room suits
- Die bonders
- Low pressure chemical vapor deposition LPCVD machines
- Micro diamond scribers
- Antistatic wrist straps
- Digital hygrometers
- Diffusion pumps
- Scanning electron microscopes
- Spectrum analyzers
- Physical vapor deposition systems
- Clean room ovens
- Electron beam evaporators
- Automatic wafer cleaners
- Atmospheric pressure chemical vapor deposition APCVD systems
- Vacuum pumps
- Slurry filter cabinets
- Wafer mappers
- Ion implanters
- Manual wet benches
- Load ports
- Mask aligners
- Chemical vapor deposition CVD systems
- Automatic notched wafer aligners
- Lithography exposure systems
- Diffusion furnaces
- Laser wafer markers
- Photostabilizers
- Photoresist strippers
- Vacuum ovens
- Solder reflow ovens
- Surface resistivity meters
- Wafer probers
- Water surface contamination analyzers
- Eyelit Manufacturing
- yieldWerx
- Microsoft Office
- Database software
- Microsoft Word
- Microsoft Excel
- National Instruments TestStand
- Camstar Systems Camstar Semiconductor Suite