Will “Epitaxial Reactor Operator” be Replaced By Robots? 🤔

88% Chance of Automation

“Epitaxial Reactor Operator” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Epitaxial Reactor Operator”

Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Connect reactor to computer, using hand tools and power tools.
Load semiconductor material into furnace.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
Scribe or separate wafers into dice.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Maintain processing, production, and inspection information and reports.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Count, sort, and weigh processed items.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.

Related Technology & Tools

Ion implanters
Automatic wafer cleaners
Sputterers
Solder reflow ovens
Vacuum pumps
Solder-paste printers
Wafer arbor presses
Safety eyewear
Vacuum ovens
Soldering guns
Spin rinse dryers
Load ports
Atmospheric pressure chemical vapor deposition APCVD systems
Wafer mappers
Clean room ovens
Vacuum wands
Diffusion pumps
Die bonders
Micro diamond scribers
Digital multimeters
Semiconductor processing chillers
Lithography exposure systems
Automatic notched wafer aligners
Plasma ashers
Wafer sorters
Desktop computers
Mask aligners
Photoresist strippers
Wafer scanners
Semiconductor polishers
Gas blow torches
Clean room suits
Scanning electron microscopes
Chemical vapor deposition CVD systems
Rapid thermal processors
Spectrum analyzers
Laboratory fume hoods
Laser wafer markers
Surface profilers
Antistatic wrist straps
Wafer probers
Photolithography equipment
Semiconductor test probes
Plasma-enhanced chemical vapor deposition PECVD machines
Semiconductor etchers
Slurry filter cabinets
Digital hygrometers
Photostabilizers
Electron beam evaporators
Sanding machines
High precision tweezers
Physical vapor deposition systems
Diffusion furnaces
Low pressure chemical vapor deposition LPCVD machines
Manual wet benches
Oxidation systems
Surface resistivity meters
Epitaxial deposition equipment
Water surface contamination analyzers
Clean-room air particle analyzers
X-ray inspection equipment

Database software
National Instruments TestStand
Microsoft Office
Eyelit Manufacturing
Camstar Systems Camstar Semiconductor Suite
Microsoft Excel
Microsoft Word
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