Will “Epitaxial Reactor Operator” be Replaced By Robots? 🤔

88% Chance of Automation

“Epitaxial Reactor Operator” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Epitaxial Reactor Operator”

Count, sort, and weigh processed items.
Load semiconductor material into furnace.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Connect reactor to computer, using hand tools and power tools.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Scribe or separate wafers into dice.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Maintain processing, production, and inspection information and reports.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

Related Technology & Tools

Vacuum pumps
Surface profilers
Surface resistivity meters
Plasma-enhanced chemical vapor deposition PECVD machines
Solder-paste printers
Solder reflow ovens
Automatic wafer cleaners
Semiconductor processing chillers
Diffusion pumps
High precision tweezers
Atmospheric pressure chemical vapor deposition APCVD systems
Die bonders
Water surface contamination analyzers
Spin rinse dryers
Digital hygrometers
Laser wafer markers
Vacuum wands
Sputterers
Manual wet benches
Wafer mappers
Diffusion furnaces
Semiconductor etchers
Wafer probers
Photoresist strippers
Load ports
Laboratory fume hoods
Clean-room air particle analyzers
Micro diamond scribers
Wafer scanners
Mask aligners
Electron beam evaporators
Ion implanters
Sanding machines
Wafer arbor presses
Wafer sorters
Plasma ashers
Automatic notched wafer aligners
Gas blow torches
Clean room suits
Photolithography equipment
Clean room ovens
Oxidation systems
Semiconductor test probes
Semiconductor polishers
Vacuum ovens
Epitaxial deposition equipment
Antistatic wrist straps
Soldering guns
Low pressure chemical vapor deposition LPCVD machines
Rapid thermal processors
X-ray inspection equipment
Chemical vapor deposition CVD systems
Digital multimeters
Scanning electron microscopes
Desktop computers
Physical vapor deposition systems
Safety eyewear
Photostabilizers
Slurry filter cabinets
Lithography exposure systems
Spectrum analyzers

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