Will “Epitaxial Reactor Operator” be Replaced By Robots? 🤔

88% Chance of Automation

“Epitaxial Reactor Operator” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Epitaxial Reactor Operator”

Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Scribe or separate wafers into dice.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Connect reactor to computer, using hand tools and power tools.
Count, sort, and weigh processed items.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Load semiconductor material into furnace.
Maintain processing, production, and inspection information and reports.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.

Related Technology & Tools

Surface profilers
Clean room suits
Wafer sorters
Epitaxial deposition equipment
Low pressure chemical vapor deposition LPCVD machines
Oxidation systems
Diffusion pumps
Photostabilizers
Lithography exposure systems
Ion implanters
Wafer scanners
Diffusion furnaces
Vacuum wands
Clean room ovens
Die bonders
Load ports
Surface resistivity meters
Clean-room air particle analyzers
Vacuum ovens
Wafer mappers
X-ray inspection equipment
Antistatic wrist straps
High precision tweezers
Soldering guns
Laser wafer markers
Digital multimeters
Gas blow torches
Solder reflow ovens
Semiconductor etchers
Plasma-enhanced chemical vapor deposition PECVD machines
Rapid thermal processors
Desktop computers
Scanning electron microscopes
Semiconductor test probes
Vacuum pumps
Wafer arbor presses
Physical vapor deposition systems
Slurry filter cabinets
Photolithography equipment
Mask aligners
Water surface contamination analyzers
Safety eyewear
Sputterers
Plasma ashers
Digital hygrometers
Laboratory fume hoods
Spin rinse dryers
Photoresist strippers
Micro diamond scribers
Atmospheric pressure chemical vapor deposition APCVD systems
Wafer probers
Spectrum analyzers
Automatic notched wafer aligners
Semiconductor polishers
Manual wet benches
Sanding machines
Solder-paste printers
Semiconductor processing chillers
Chemical vapor deposition CVD systems
Electron beam evaporators
Automatic wafer cleaners

Database software
yieldWerx
Microsoft Office
National Instruments TestStand
Microsoft Excel
Eyelit Manufacturing
Camstar Systems Camstar Semiconductor Suite
Microsoft Word