Will “Crystal Finisher” be Replaced By Robots? 🤔

88% Chance of Automation

“Crystal Finisher” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Crystal Finisher”

Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Maintain processing, production, and inspection information and reports.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Load semiconductor material into furnace.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Count, sort, and weigh processed items.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Scribe or separate wafers into dice.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Connect reactor to computer, using hand tools and power tools.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

Related Technology & Tools

Solder-paste printers
Clean room suits
Physical vapor deposition systems
Photolithography equipment
Antistatic wrist straps
Wafer probers
Diffusion pumps
Manual wet benches
Diffusion furnaces
Slurry filter cabinets
High precision tweezers
Clean-room air particle analyzers
Digital multimeters
Oxidation systems
Sanding machines
Automatic notched wafer aligners
Die bonders
Epitaxial deposition equipment
Laboratory fume hoods
Digital hygrometers
Spectrum analyzers
Micro diamond scribers
Automatic wafer cleaners
Photostabilizers
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Semiconductor test probes
Plasma-enhanced chemical vapor deposition PECVD machines
Semiconductor processing chillers
Surface profilers
Rapid thermal processors
Vacuum pumps
Low pressure chemical vapor deposition LPCVD machines
Lithography exposure systems
X-ray inspection equipment
Wafer mappers
Vacuum ovens
Photoresist strippers
Atmospheric pressure chemical vapor deposition APCVD systems
Laser wafer markers
Semiconductor etchers
Load ports
Solder reflow ovens
Ion implanters
Soldering guns
Sputterers
Electron beam evaporators
Mask aligners
Clean room ovens
Safety eyewear
Surface resistivity meters
Wafer scanners
Vacuum wands
Wafer arbor presses
Scanning electron microscopes
Wafer sorters
Water surface contamination analyzers
Chemical vapor deposition CVD systems
Plasma ashers
Desktop computers
Gas blow torches

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