Will “Semiconductor Wafers Etcher-Stripper” be Replaced By Robots? 🤔

88% Chance of Automation

“Semiconductor Wafers Etcher-Stripper” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Semiconductor Wafers Etcher-Stripper”

Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Load semiconductor material into furnace.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Count, sort, and weigh processed items.
Connect reactor to computer, using hand tools and power tools.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Scribe or separate wafers into dice.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Maintain processing, production, and inspection information and reports.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

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