Will “Engineering Technician” be Replaced By Robots? 🤔

88% Chance of Automation

“Engineering Technician” will probably be replaced by robots.

This job is ranked #514 out of #702. A higher ranking (i.e., a lower number) means the job is less likely to be replaced.

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Job Description

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Job Details

The SOC (Standard Occupational Classification) code is 51-9141.00
The Mean Annual Wage in the U.S. is $ 37,890.00
The Mean Hourly Wage is $ 18.00
Currently, there are 24,430 people on this job

☝️ Information based on the reference occupation “Semiconductor Processors”.

Also Known As…

Tasks for “Engineering Technician”

Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
Connect reactor to computer, using hand tools and power tools.
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
Maintain processing, production, and inspection information and reports.
Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.
Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Load and unload equipment chambers and transport finished product to storage or to area for further processing.
Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
Stamp, etch, or scribe identifying information on finished component according to specifications.
Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
Scribe or separate wafers into dice.
Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
Inspect equipment for leaks, diagnose malfunctions, and request repairs.
Count, sort, and weigh processed items.
Calculate etching time based on thickness of material to be removed from wafers or crystals.
Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
Load semiconductor material into furnace.
Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

Related Technology & Tools

Water surface contamination analyzers
Clean room suits
Photolithography equipment
Vacuum pumps
Vacuum ovens
Automatic notched wafer aligners
Slurry filter cabinets
Clean room ovens
Digital multimeters
Lithography exposure systems
Mask aligners
Semiconductor etchers
Wafer arbor presses
Wafer mappers
Spin rinse dryers
Clean-room air particle analyzers
Ion implanters
Wafer scanners
Epitaxial deposition equipment
Plasma ashers
Die bonders
Manual wet benches
Oxidation systems
Photostabilizers
Sputterers
Automatic wafer cleaners
Semiconductor polishers
Micro diamond scribers
Plasma-enhanced chemical vapor deposition PECVD machines
Scanning electron microscopes
Diffusion furnaces
Diffusion pumps
Load ports
Desktop computers
Soldering guns
Photoresist strippers
Rapid thermal processors
Solder reflow ovens
Surface resistivity meters
Low pressure chemical vapor deposition LPCVD machines
Spectrum analyzers
Semiconductor processing chillers
Electron beam evaporators
High precision tweezers
X-ray inspection equipment
Sanding machines
Wafer probers
Solder-paste printers
Wafer sorters
Digital hygrometers
Physical vapor deposition systems
Laser wafer markers
Antistatic wrist straps
Chemical vapor deposition CVD systems
Semiconductor test probes
Laboratory fume hoods
Surface profilers
Gas blow torches
Safety eyewear
Atmospheric pressure chemical vapor deposition APCVD systems
Vacuum wands

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yieldWerx
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